• AlN /Aluminum nitride ceramic ring
  • AlN /Aluminum nitride ceramic ring

AlN /Aluminum nitride ceramic ring

No.AlN /Aluminum nitride ceramic ring
Aluminum nitride ceramics are made of aluminum nitride (AlN) sintered at high temperature. The molecular formula of aluminum nitride is AlN, the molecular weight is 40.99, the common melting point is mp 2400°C (dec), and the common density is 3.26 g/cm3. Its common Its structure is cubic β-AlN and hexagonal α-AlN. It is an advanced ceramic material with excellent performance. The thermal conductivity of aluminum nitride is usually between 100-320W/(m·K), which is related to the purity and preparation process. The better the preparation, the higher the purity, and the higher the thermal conductivity. It is also affected by the temperature environment. Aluminum nitride (AlN) ceramics have good high temperature resistance and mechanical strength, and can remain stable under high temperature, high pressure, and harsh environments. Mainly used to manufacture ceramic heat sinks, aluminum nitride substrates, packaging materials, sensors, high-frequency electronic devices, aluminum nitride wafers and aluminum nitride crucibles, etc.
  • AlN /Aluminum nitride ceramic ring

Description

Aluminum nitride ceramics are made of aluminum nitride (AlN) sintered at high temperature. The molecular formula of aluminum nitride is AlN, the molecular weight is 40.99, the common melting point is mp 2400°C (dec), and the common density is 3.26-3.31 g/cm3. Its common Its structure is cubic β-AlN and hexagonal α-AlN. It is an advanced ceramic material with excellent performance. The thermal conductivity of aluminum nitride is usually between 100-320W/(m·K), which is related to the purity and preparation process. The better the preparation, the higher the purity, and the higher the thermal conductivity. It is also affected by the temperature environment. Aluminum nitride (AlN) ceramics have good high temperature resistance and mechanical strength, and can remain stable under high temperature, high pressure, and harsh environments. Mainly used to manufacture ceramic heat sinks, aluminum nitride substrates, packaging materials, sensors, high-frequency electronic devices, aluminum nitride wafers and aluminum nitride crucibles, etc.


AlN/Aluminum nitride mechanical properties

 

Name AlN/Aluminum nitride
Density g/cm3 3.31
Modulus of Elasticity GPa 310
Fracture toughness Mpa x m^1/2 3.5
Poisons Ratio 0.25
Compressive Strength MPa 2100
Flexural Strength MPa 335
Hardness (Vickers) GPa 11
Hardness (Knoop 100 g) Kg/mm2 1170


Name AlN/Aluminum nitride
Maximum Temperature Oxidizing 750°C Inert 1300°C
Thermal Conductivity @ 25°C 180W/mK @ 300°C 130W/mK
Specific Heat 760J/kg.K
Thermal Shock Resistance ΔT 400°C
Coefficient of Expansion(10^-6/°C) CTE 25°C ➞ 300°C 4.6 CTE 25°C ➞ 1000°C 5.6
Dielectric Constant 8.6 (1 MHz)
Loss Tangent 5×10^-4(1 MHz)
Volume Resistivity 25°C >10^13Ω cm 500°C 10^7Ω cm


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