Aluminum Nitride (AlN) ceramic features high thermal conductivity (≥170 W/m·K), excellent electrical insulation, and low thermal expansion, making it ideal for heat dissipation and electronic packaging, especially for high-power and high-frequency electronics. Like other ceramic materials, it exhibits high hardness, excellent mechanical strength, corrosion resistance, and high-temperature stability, making it suitable for structural components in harsh environments.
AlN ceramics offer excellent thermal stability, retaining their properties above 2000°C in inert atmospheres. In air, oxidation starts at approximately 600–700°C, forming a protective Al2O3 layer that slows further oxidation. This layer remains stable up to around 1370°C, but at higher temperatures, oxidation may progress, potentially impacting the material’s integrity.
Properties
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High hardness and excellent mechanical strength
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Excellent high-temperature resistance
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Thermal expansion similar to that of silicon
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Superior thermal conductivity
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Excellent corrosion resistance
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Non-toxic and environmentally friendly
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High electrical breakdown strength
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Low dielectric constant and minimal dielectric loss
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Applications
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Semiconductor Equipment Modules
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Optical Communication & RF Modules
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LED & Laser Packaging Modules
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Power Electronics Modules
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Thermal Management Components
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High-Frequency Microwave & Radar Modules
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Medical & Sensing Modules
