• Aluminum Nitride Ceramic Disc
  • Aluminum Nitride Ceramic Disc

Aluminum Nitride Ceramic Disc

No.Aluminum Nitride Ceramic Disc
Aluminum nitride (AlN) ceramic is a high-performance advanced ceramic material. Its room temperature thermal conductivity reaches 170-230 W/(m·K), which is 5-10 times that of alumina (Al₂O₃) and comparable to metallic aluminum. It has a volume resistivity >10¹⁴ Ω·cm, a low dielectric constant (8-9), and low high-frequency losses.
  • Aluminum Nitride Ceramic Disc

Description

Aluminum nitride (AlN) ceramic is a high-performance advanced ceramic material. Its room temperature thermal conductivity reaches 170-230 W/(m·K), which is 5-10 times that of alumina (Al₂O₃) and comparable to metallic aluminum. It has a volume resistivity >10¹⁴ Ω·cm, a low dielectric constant (8-9), and low high-frequency losses.

Aluminum nitride (AlN) ceramic is a high-performance advanced ceramic material with wide applications in electronics, aerospace, and semiconductors due to its unique physical and chemical properties. Here is a detailed introduction to its core advantages:
1. Extremely High Thermal Conductivity: High thermal conductivity: The room temperature thermal conductivity of aluminum nitride can reach 170-230 W/(m·K), which is 5-10 times that of alumina (Al₂O₃) and comparable to metallic aluminum, but with superior insulation. Suitable for high-frequency/high-power devices: It is an ideal substrate material for high-power integrated circuits and LED heat dissipation substrates, effectively solving the heat dissipation problem of electronic devices.

2. Excellent Thermal Stability: High melting point: Approximately 2200°C, maintaining structural stability even at high temperatures. Low coefficient of thermal expansion (4.5×10⁻⁶/°C, close to that of silicon chips), reducing thermal stress and avoiding cracking problems caused by thermal mismatch in electronic packaging.

3. Excellent electrical insulation: Volume resistivity > 10¹⁴ Ω·cm, low dielectric constant (8-9), low high-frequency loss, suitable for applications such as high-frequency circuit boards and microwave window materials.

4. Good mechanical properties: High hardness (Mohs hardness 7-8) and flexural strength (300-400 MPa), wear-resistant and corrosion-resistant, suitable for harsh working conditions (such as etching cavities in semiconductor equipment). However, it is relatively brittle and requires doping or composite modification to improve toughness.

5. Chemical inertness and corrosion resistance: Resistant to acid and alkali corrosion, especially stable against molten metals (such as aluminum and copper) at high temperatures, suitable for metal smelting crucibles, sputtering targets, etc.

6. Environmentally friendly and biocompatible: Lead-free and non-toxic, RoHS compliant, suitable for use in biomedical devices or high-temperature sensors.

7. Machinability (relative advantage): Despite its high hardness, it can be made into complex shapes, such as thin sheets and three-dimensional structures, through precision grinding and laser processing.


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